Hesse & Knipps (Wedge Bonder)                                                     made in Germany

Besides Fine and Heavy Wire Bonders and Ultrasonic Flipchip-Bonders. Hesse & Knipps develops and manufactures standard and custom solutions for Automation.

* Fine Wire Wedge Bonder

* Ribbon Bonder

* Deep Access Bonder

* Heavy Wedge Bonder

* Ultrasonic Flip-Chip Bonder

Advanced Dicing Technologies (Dicing Equipment, Blade)            made in Israel

 ADT is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronics Components (MECs) and in package Singulation.
* 7100/7200 Single Spindle Dicing Saw
* 7900 Dual Spindle Dicing Saw
* 8000 NextStep Laser Scribing System
* Resin, Sinter, Nickel blade

Assembleon  (Pick & Place with Flip Chip)                                          made in Nevertheland

 Assembléon is a global supplier of Surface Mount Technology (SMT) Pick & Place solutions for the electronics manufacturing industry. By integrating the Direct Die Feeder (DDF), it picks up die from the wafer frame, perform Flip Chip bonding on the PCB or output devices.
* AX-301
* DDF

DeWeyl  (Wedge, Tap Tools, Cutters)                                                                     made in USA

 DeWeyl Tool is the largest OEM tool supplier in the industry, supplying tools to major wedge bonder manufacturer. We can provide special materials based on your application requirements.
* Thin wedge, round wire and ribbon
* Heavy wedge, round wire and ribbon
* Tap Tools
* Cutters