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We have a strong sales & support network distributing semiconductor equipment & material in China market. We are specializing in Dicing, Wire Bonding (ball bond, wedge bond) & RFID related product, providing OEM automation manufacturing, wire bonder refurbished services.
Hesse & Knipps launches BJ935/BJ935 high Speed Heavy Wedge Bonder.

ADT, Advanced Dicing Technologies has a new Dual Spindle Dicing Saw, Model 7900. Target for LED dicing.

DeWeyl Ceramic Tips Wedge improves your bond quality and life time.
Hero Fair Limited
Unit 1901-2 Westin Centre, 26 Hung To Road, Kwun Tong, Hong Kong.
Phone: (852) 3426-8850
sales@herofair.com

Shanghai: 13817686828 YK Siu
Shenzhen: 13670130810 Ryan So
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