Product Representative & ODM Solutions

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Our company


Hero Fair have a strong sales and support network distributing semiconductor equipment and material in China market.

We have excellent technical knowhow specialized in Thin Wedge Bonding, Heavy Wire Bonding, Dicing, Die Attach, Ball Bonding, Plasma Cleaning and other semiconductor process.

We have a solid customer base including all major multinational corporation and government owned institute, we provide ODM automation solution.

Products

Our equipment and material solutions

Want to get a quote? Having any questions? Contact us now!

Our Contacts

About Herofair

History and milestones

  • 2000

    Our Humble Beginnings

    Start with semiconductor technical service support

  • 2003

    Product Distributor

    Distributing ADT dicing products in China & Hong Kong

  • 2004

    Product Representative

    Representing Hesse Mechatronics in China & Hong Kong

  • 2006

    Hero Fair Automation

    ODM project for semiconductor equipment

  • Be Part
    Of Our
    Story!

Our Sales Team

Our expert team

YK Siu

Sales Director - Northern China

Snow Xue

Shanghai

JF Wang

Shanghai

QB Huang

Shanghai

MF Wong

Sales Director - Southern China

Denny Zhou

Shenzhen

Jackly Huang

Shenzhen

Xiao Feng

Shenzhen

Contact Us

Feel free to contact us for quotes and informations

KC Lai

Engineering Director- Automation

  • +(86) 135-10796016
  • +(852) 9125 0704
  • kclai@herofair.com

YK Siu

Sales Director - Northern China

  • +(86) 138-17686828
  • +(852) 9267 4760
  • yksiu@herofair.com

MF Wong

Sales Director - Southern China

  • +(86) 151-12207921
  • +(852) 5636 2008
  • mfwong@herofair.com

Sunny Xu

Sales & Marketing

  • +(86) 0755-28092140
  • +(86) 189-23769974
  • sunnyxu@herofair.com



Hero Fair Limited

  • 1902, Westin Centre, 26 Hung To Road, Kwun Tong, Hong Kong
  • +(852) 3426 8850