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We
have a strong sales & support network
distributing semiconductor equipment &
material in China market. We are
specializing in Dicing, Wire Bonding
(ball bond, wedge bond) &
RFID related product, providing
OEM automation manufacturing, wire
bonder refurbished services.
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Hesse & Knipps launches BJ935/BJ935 high Speed Heavy Wedge Bonder. ADT, Advanced Dicing Technologies has a new Dual Spindle Dicing Saw, Model 7900. Target for LED dicing. DeWeyl Ceramic Tips Wedge improves your bond quality and life time. |
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Hero Fair Limited Unit 1901-2 Westin Centre, 26 Hung To Road, Kwun Tong, Hong Kong. Phone: (852) 3426-8850 sales@herofair.com Shanghai: 13817686828 YK Siu Shenzhen: 13670130810 Ryan So |
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| Home | Company | Products | Catalog | Support | News | Contact Us | Copyright © Hero Fair Limited |
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